Thermally enhanced pressure regulation of electronics cooling system
US7257000B2 · kind B2 · utility
2Cited by
28References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2004 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Aug 2, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A two-phase cooling system operated at atmospheric pressure. A reservoir containing cooling fluid has a stack that is vented to the atmosphere. The stack is shaped to allow condensation of substantially all of the cooling fluid in vapor form entering the stack. Condensation may be enhanced by cooling the stack, such as with flowing air along the outer walls of the stack or placing a thermoelectric device in contact with the stack. The system provides high thermal capacity but is easy to use and service.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.