Inter-process sensing of wafer outcome
US7257494B2 · kind B2 · utility
4Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2005 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | May 11, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of monitoring a microelectronic manufacturing process includes the implementation of a monitoring sensor that is configured to operate in an inter-process mode. During an inter-process mode, a first valve is opened in order to initiate transfer of a processing substrate between at least one processing chamber and a transfer chamber. The monitoring sensor is programmed to monitor the interior of the at least one processing chamber only after the first valve is opened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.