Combination apparatus for machining material with a milling cutter and a laser
US7257879B1 · kind B1 · utility
18Cited by
12References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 23, 2007 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Jan 23, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T408/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is directed to an apparatus for cutting material by means of a milling cutter and laser radiation. The apparatus comprises a milling unit, a work spindle, a milling cutter, a laser, deflecting elements, focusing optics, and a work table. According to the invention, a workpiece can be milled and lasered simultaneously or successively at the same cutting location in that the laser beam is coupled into a channel coaxial to the mill axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.