Cooling apparatus
US7257956B2 · kind B2 · utility
13Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2005 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Feb 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling apparatus configured such that a cooling body provided with heat-dissipating plates is pressed against a device to which a socket of a burn-in board is attached, and air is provided by a blower such that the air passes between the heat-dissipating plates, and compressed air provided from a compressed air supply system is discharged by a nozzle so that it directly hits a portion of the cooling upper surface of the cooling body. By means of the cooling effects from these two types of air, a device generating a large amount of heat can be cooled with good temperature accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.