Cooling system for densely packed electronic components
US7258161B2 · kind B2 · utility
55Cited by
43References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2004 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Jul 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A more efficient cooling system for densely packed electronic components for use in an out-of-doors equipment enclosure. An array of cooling assemblies are placed on heat generating components mounted to printed circuit boards mounted in enclosure racks. Each board has a manifold for intake and exhaust of refrigerant, and larger rack manifolds are substituted for rails and are attached to a backplane. A hybrid package including a ceramic hybrid power module and an attached array of cooling assemblies provide even more density of components and improved cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.