Method and device for centerless cylindrical grinding
US7258594B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 6, 2002 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Sep 2, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
During centerless cylindrical grinding, attention must be paid to the fact that the workpiece (3) is placed in a very specific position between the grinding wheel (1), the regulating wheel (2) and the support guide (4). The optimal position of the workpiece (3) initially set cannot be maintained as a result of the progression of the grinding process and the changes caused by said process in the diameter and contour of the workpiece (3). The invention provides a solution to said problem, whereby height adjustment and/or the oblique position of the support guide (4) are automatically modified in accordance with the progression of the grinding process and during said grinding process with the purpose of achieving operationally optimal readjustment. The progression of the grinding process can be detected using measuring techniques, e.g. by measuring the diameter of the workpiece (3) or its deviation from roundness and using said measurement as output variable for adjusting the support guide (4).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.