Hermetically sealing a package to include a barrier metal
US7259032B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2003 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Mar 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an electronic device includes the steps of forming a first resist pattern on a primary surface of a SAW element, the first resist pattern having openings at positions corresponding to those at which bumps and a sealing frame are to be formed, sequentially forming metals over the first resist pattern, the metals being formed into adhesion layers, barrier metal layers, and solder layers, removing the first resist pattern on the SAW element such that the bumps and the sealing frame are simultaneously formed. When the bumps and the sealing frame of the SAW element are bonded to bond electrodes of the bond substrate, the solder layers are melted and alloyed by heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.