Polyamide resin composition and process for producing the same
US7259196B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2003 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Jul 23, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L25/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide a polyamide resin composition having high mechanical properties and high heat resistance while achieving a satisfactory balance between various physical properties. A molded product made of this polyamide resin exhibits a lower warpage and excellent surface appearance. A method for producing the polyamide, resin composition is also provided. The present invention provides a polyamide resin composition containing a polyamide resin and swelling mica treated with a polyether compound having a bisphenol structure. The present invention also provides a method for making the polyamide resin composition including melt-mixing a polyamide resin with a polyether compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.