High density front access device
US7259325B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2005 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Mar 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q2201/10
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A high density device comprising: a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, the chassis frame defining a front plane and a back plane, the front plane being substantially coincident with a front support of the telecommunications rack; a sub-module chassis secured to the chassis frame, the sub-module chassis exhibiting a proximal face and a distal face; a first plurality of jacks located distal of the proximal face of the sub-module chassis; and a passageway formed between the sub-module chassis and an inner wall of the chassis frame, the passageway configured and dimensioned for the passage of cabling for connection to the first plurality of jacks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.