Solder-bearing wafer for use in soldering operations
US7259335B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2004 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Jun 28, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder-bearing wafer is provided for use in a soldering operation. The solder-bearing wafer is designed to provide a solder material which is used in a soldering operation for electrically connecting a first electronic device to a second electronic device. According to a first embodiment, the wafer comprises a substrate body having a first surface and an opposing second surface. The first surface has at least one groove formed therein and the wafer also includes at least one length of solder material securely disposed within the at least one groove. Upon heating of the at least length of solder material and placement of the substrate body between the first and second electronic devices, at least one first contact of the first electronic device is securely and electrically connected to at least one second contact of the second electronic device. The first and second electronic devices may be of a through hole type, surface mount type, or ball grid array type.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.