Heat treating assembly and method
US7259351B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2004 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Sep 7, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/702
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The subject invention provides a heat treating assembly. The heat treating assembly comprises a laser, a substrate, and a tool. The laser emits laser energy directed toward the substrate and the tool. The substrate absorbs the laser energy and produces heat energy within the substrate that alters the substrate. The tool is disposed in removable contact with the substrate to conduct the heat energy away from the substrate to limit the altering of the substrate. Preferably, the tool has a thermal conductivity greater than that of the substrate and is more preferably a copper material, a gold material, a silver material, or an aluminum material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.