Method and apparatus for placing sensors using 3D models
US7259778B2 · kind B2 · utility
39Cited by
16References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2004 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Feb 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N7/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for dynamically placing sensors in a 3D model is provided. Specifically, in one embodiment, the method selects a 3D model and a sensor for placement into the 3D model. The method renders the sensor and the 3D model in accordance with sensor parameters associated with the sensor and parameters desired by a user. In addition, the method determines whether an occlusion to the sensor is present.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.