Deposition of buffer layers on textured metal surfaces
US7261776B2 · kind B2 · utility
10Cited by
27References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2004 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Jan 13, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/929
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of making a multilayer article includes depositing a first material on the surface of a metal substrate to form a seed layer of the first material, the first material being deposited under reducing conditions relative to the metal substrate, and then epitaxially depositing a second material on a surface of the seed layer, wherein the second material is deposited from a solution-based precursor under second conditions that are more oxidizing than the reducing conditions used in the deposition of the first material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.