Method of producing piezoelectric component and piezoelectric component
US7261792B2 · kind B2 · utility
2Cited by
9References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2003 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | May 6, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1093
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave element is mounted onto a mounting substrate having a terminal electrode via a bump by flip chip bonding. The surface acoustic wave element is covered with a resin film. The periphery of the surface acoustic wave element mounted on the mounting substrate is covered with a portion of the resin film so that the surface acoustic wave element is sealed. The resin film is hardened. Thus, a surface acoustic wave device is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.