Halogen-free dry film photosensitive resin composition
US7261996B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 26, 2006 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Jan 26, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/027
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a halogen-free dry film photosensitive resin composition, which comprises (a) 10˜60 wt % of at least two kinds of acrylic resins having unsaturated carboxylic acid monomers as polymerized units; (b) 5˜20 wt % of a photosensitive resin having at least two (meth)acrylate groups; (c) 0.1˜15 wt % of a photoinitiator; and (d) 0.5˜20 wt % of a thermo-curing agent. The resin composition of the invention is suitable for use as a photoresist in the process of producing printed circuit boards. The resin composition of the invention is particularly suitable for use in the surface of printed circuit boards or semiconductor packages as a protective dry film solder mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.