Resin composition
US7262238B2 · kind B2 · utility
0Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2004 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Oct 22, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F236/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention refers to a resin composition comprising an ester compound and a polymer, wherein the ester compound and the polymer are obtainable by reacting a diene, a dienophile and a carboxylic acid. The invention also refers to adhesive compositions comprising the resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.