Low-density sealing mass, ground mass and method for producing the same and the use thereof

US7262245B2 · kind B2 · utility

Assignee

• CHEMETALL GMBH · DE

Inventors

• Peter Bons · Reichelsheim, DE
• Heinz Burock · Frankfurt am Main, DE
• Francisco Diez · Mörfelden, DE
• Andrea C. PAUL · Iron River, US
• Heiko Diehl · Mannheim, DE

Key dates

• Filing date: Apr 5, 2002
• Grant date: Aug 28, 2007
• Expiry date: Apr 5, 2022

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L81/04
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention relates to a sealing mass with low density and improved tensile strength on the basis of sulfur-containing polymers such as on the basis of polysulfide, polyether or/and polytioether that has a density of not more than 1.3 g/cm3 according to ISO 2781 and a tensile strength of at least 1.9 N/mm2 according to ISO 37 after curing. The invention further relates to a ground mass based on sulfur-containing polymers for producing a sealing mass that comprises at least one long-chain linear polymer and at least one short-chain branched polymer having a content in trifunctional molecules, or/and at least one multifunctional cross-linker with a number of functional groups n≧3. The invention further relates to a method for producing a sealing mass according to which at least one base polymer is mixed with at least one adhesion promoter and the at least one light filler, especially hollow filler, is added, a vacuum with a remaining pressure of less than 50 mbar being maintained during incorporation of the light filler.