Hot melt adhesive composition based on a random copolymer of isotactic polypropylene and a secondary polymer
US7262251B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2003 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Feb 23, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/674
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, about 0%-60% by weight of an atactic poly-α-olefin (APAO), and about 0%-40% by weight of a secondary polymer. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.