Process and apparatus for modifying a surface in a work region
US7262408B2 · kind B2 · utility
3Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2006 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Jun 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32357
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and process for manufacturing changes of a substrate in a work region which is 100×100×100 microns or smaller is described. The apparatus uses a plasma source adjacent to the work region to produce radiation or matter which changes the surface. An atomic force microscope or laser can be used in addition. The process and apparatus can be used to produce MEMS devices on a substrate for use in a wide variety of applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.