Thermal structure for electric devices
US7262965B2 · kind B2 · utility
7Cited by
8References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 28, 2005 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Oct 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal structure includes a fin module, a heat sink base, a heat pipe, a fan housing, and a fan. One end of the heat pipe is connected with the fin module and the other end of the heat pipe is installed on the heat sink base. The fan housing is fixed on the fin module. Blades are installed inside the fan housing. The fan includes inlets on an upper surface and a lower surface of the fan housing and a outlet on a side surface of the fan housing, so as to absorb heat through the inlet and eliminate the heat through the outlet. Therefore, the heat dissipating efficiency is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.