Heat sink clip assembly
US7262969B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 14, 2004 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Aug 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink clip assembly is for attaching a heat sink (10) to a motherboard (60). The motherboard and the heat sink each respectively define through apertures (52) and through holes (16) therein. The heat sink clip assembly includes four sleeves (46), four posts (38), four fasteners (41), and four spring members (44). Each sleeve comprises a top section and a bottom section. The top sections of the sleeves engage in the through holes respectively to attach the sleeves to the heat sink. The posts extend through the through apertures and received in the bottom sections of the sleeves. Each fastener includes a top head and a bottom end, the bottom ends extend into the sleeves and coupled to the top portions of the posts. The spring members are compressed between the top heads of the fasteners and the heat sink urging the heat sink toward the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.