Infrared data communication module and method of making the same
US7263294B2 · kind B2 · utility
5Cited by
5References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 23, 2002 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Mar 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An infrared data communication module includes a substrate having a surface on which a light emitting element, a light receiving element, and an IC element are mounted. A resin package is formed on the substrate for integrally enclosing the light emitting element, the light receiving element and the IC element. A shield member is formed within the resin package for covering the IC element to prevent light-attributable noises from reaching the IC element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.