Modular optical device package
US7264408B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2005 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | May 10, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4246
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of the present invention are directed to a modular optical device for sending and/or receiving optical signals. A lens block is configured to mechanically couple to one or more lens pins and to a molded package. A molded package, including at least one of a light source and a light detector and including a connection portion manufactured for direct mechanical and electrical coupling of the molded package to a substrate, is mechanically coupled to the lens block. At least one lens pin for directing an optical signal between a light source or light detector and corresponding external components is coupled to the lens block. The modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.