Platen mounted post mold cooling apparatus and method
US7264463B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2006 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Jul 28, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/253
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Platen-mounted, post-mold cooling apparatus and method includes structure and/or steps for handling molded parts in an injection molding machine having a fixed platen, a moving platen, a core half, and a cavity half. A take off device coupled to the fixed platen is configured to remove molded parts from either the core half or the cavity half. A cooling device coupled to the moving platen is configured to cool the molded parts carried by the take off device. Preferably, the take off device extracts the just molded parts from the mold's core half and then moves linearly outboard of the mold halves. The subsequent movement of the moving platen to close the mold in the next molding cycle causes the cooling device's pins to engage the molded parts in the take off device part carriers. When the moving platen opens again, the molded parts are extracted from the part carriers by the cooling device pins. When the moving platen is fully open, the cooling device is rotated to eject the cooled parts from the machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.