Removable flash integrated memory module card and method of manufacture
US7264992B2 · kind B2 · utility
24Cited by
7References
18Claims
0Family size
Inventors
Key dates
| Filing date | Aug 6, 2004 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Feb 1, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.