Semiconductor device including inclined cut surface and manufacturing method thereof
US7264997B2 · kind B2 · utility
7Cited by
5References
31Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 16, 2004 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Jan 2, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surface that is joined via a joining agent to an external mounting circuit board, wherein the electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.