Bond method and structure using selective application of spin on glass
US7265027B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 14, 2005 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Jun 14, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding substrate structures. The method includes providing a transparent substrate structure, the transparent substrate structure comprising a face region and an incident light region, providing a spacer structure, the spacer structure comprising a selected thickness of material, the spacer structure having a spacer face region and a spacer device region, and providing a device substrate structure, the device substrate having a device face region and a device backside region. The method further includes applying a first glue material to the spacer face region and bonding the spacer face region to the face region of the transparent substrate structure. The method also includes applying a second glue material to the spacer device region and bonding the spacer device region to the device face region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.