Methods for making microwave circuits
US7265043B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2006 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Aug 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are methods for making microwave circuits using thickfilm components. In an embodiment, the method includes depositing a dielectric over a ground plane, and then forming a conductor on the dielectric. The conductor is formed by depositing a conductive thickfilm on the dielectric and then “subsintering” the conductive thickfilm. In one embodiment, before the subsintering, the conductive thickfilm is patterned to define at least one conductor. In another embodiment, after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired at a full sintering temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.