Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
US7265167B2 · kind B2 · utility
1Cited by
5References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 10, 2003 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Dec 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.