Next high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes
US7265300B2 · kind B2 · utility
57Cited by
27References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2004 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Dec 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes PCB substrates made of materials having different dielectric frequency characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.