Mounting structure for semiconductor parts and semiconductor device
US7265446B2 · kind B2 · utility
0Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2004 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Oct 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To arrange semiconductor parts such as chip resistors and the like between a BGA and a mounting substrate, an interposes is disposed between the BGA and the mounting substrate for mounting the BGA thereon. The interposer serves to maintain the distance between the mounting substrate and the BGA to be just as large as or larger than the thickness of the semiconductor parts and to electrically connect solder balls of the BGA and electrically conductive patterns of the mounting substrate. The semiconductor parts are mounted on the mounting substrate before fixing the BGA 22 to the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.