First die indicator for integrated circuit wafer
US7265567B2 · kind B2 · utility
2Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2005 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Jul 13, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) wafer includes a plurality of die and a first die indicator (FDI) formed on the wafer in a metal layer. The plurality of die include a first potentially good die and the FDI, which is detectable by a machine vision recognition system, provides a unique indication of the first potentially good die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.