Electrostatic chuck and production method therefor
US7265962B2 · kind B2 · utility
2Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2004 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Aug 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an electrostatic chuck comprising a substrate, a dielectric layer formed by thermal spraying on an upper face of the substrate, an internal electrode embedded in the dielectric layer, a feeder terminal portion extending from a lower face of the substrate to the internal electrode, and an electrode provided in the feeder terminal portion, wherein the feeder terminal portion and the substrate are fixed to each other by mechanical joining.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.