Heat sink and component support assembly
US7265985B2 · kind B2 · utility
9Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2004 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Sep 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20918
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink and component support assembly that includes a core structure (110). The core structure (110) includes: a central member (112) having first (114, 116) and second opposing sides; at least one heat dissipating surface (124, 126, 128) extending from at least one of the first opposing sides (114, 116); and first and second extension members (118, 120) positioned adjacent to each of the second opposing sides. The assembly may also include an airflow facilitating arrangement, such as a fan (184), positioned adjacent to the core structure (110) for further enhanced heat dissipating capabilities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.