Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof
US7266262B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 22, 2003 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | May 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Transmission of electric and optical signal, realization of high-speed and high capacity of transmission of information signals. A base substrate section having an interconnect layer formed on an insulating substrate by a printed circuit process; a micro interconnect circuit section having a micro electrical interconnect layer which is finer than the interconnect layer of the base substrate section, formed on an insulating resin layer by a semiconductor process; and an optical interconnect circuit section adapted to transfer and/or receive an optical signal and provided with an optical wave-guide having an input section and an output section of a optical signal at opposite ends thereof; and at least a pair of optical elements composed of a light emitting device with a light emitting section thereof facing the input section and a photo detecting device with a photo detecting section thereof facing the output section are provided and the micro interconnect circuit section and the optical interconnect circuit section are mounted on the base substrate section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.