Bidirectional singulation saw and method
US7267037B2 · kind B2 · utility
Inventors
Key dates
| Filing date | May 5, 2001 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Jun 4, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/8822
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A singulation saw for sawing either substrate or wafers includes a pair of counter-rotating saw blades mounted for independent movement in a vertical direction for alternatively engaging with a substrate to be singulated. The singulation saw further includes a transport system including a pair of substrate carriers reciprocates the substrates. While the first substrate is being cut, the second substrate or other substrate carrier sequentially unloads a cut substrate, loads a new uncut substrate and then moves the uncut substrate to a vision system for determining the position of the substrate relative to the second carrier and then positions the second carrier and its substrate in a standby position ready to be cut by the pair of saw blades that are cutting the first substrate. As the first cut substrate is moved to an unload position, the new uncut substrate is moved into a cutting position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.