Method for enhancing the solderability of a surface
US7267259B2 · kind B2 · utility
2Cited by
18References
7Claims
0Family size
Inventors
Key dates
| Filing date | Jun 6, 2003 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Feb 22, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/54
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.