Manufacturing method of piezoelectric/electrostrictive film type device
US7267840B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2003 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | May 4, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/2047
Abstract
A method is provided for manufacturing a piezoelectric/electrostrictive film device including a ceramic substrate and a piezoelectric/electrostrictive operation portion including a lower electrode, a piezoelectric/electrostrictive layer, and upper electrode stacked on the substrate. The piezoelectric/electrostrictive layer is formed to extend beyond at least one of electrodes to form projected portions at its ends. The method includes the steps of forming the piezoelectric/electrostrictive layer so that ends of the piezoelectric/electrostrictive layer are projected to extend beyond ends of at least one electrode, applying a coating liquid in a sufficient amount so that the coating liquid permeates through a gap between at least the projected end portion of the piezoelectric/electrostrictive layer and the substrate, and so as to coat a predetermined portion of the at least one electrode, and drying the applied coating liquid to form a coupling member to couple the projected end portions of the piezoelectric/electrostrictive layer to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.