Hot-melt adhesive in particulate form

US7267878B2 · kind B2 · utility

Assignee

• Henkel Kommanditgesellschaft auf Aktien (Henkel KGAA) · DE

Inventors

• Hartmut Primke · Bopfingen, DE
• Gerald Petry · Hückelhoven, DE
• Ingolf Scheffler · Wiesloch, DE
• Juergen Wichelhaus · Wuppertal, DE
• Michael Krebs · Hilden, DE
• Michael Lee Rudolph · Newark, US
• Andrew Nixon · Huddersfield, GB
• Hans-Peter Kohlstadt · Velbert, DE

Key dates

• Filing date: Nov 7, 2003
• Grant date: Sep 11, 2007
• Expiry date: Dec 20, 2024

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/3158
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A moisture-curing hot-melt-adhesive composition in granulate, tablet or powder form can be produced by