Electronic device including a guest material within a layer and a process for forming the same
US7268006B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2004 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Dec 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/615
Abstract
A process for forming an electronic device includes forming a first layer over a substrate and placing a first liquid composition over a first portion of the first layer. The first liquid composition includes at least a first guest material and a first liquid medium. The first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer. An electronic device includes a substrate and a continuous first layer overlying the substrate. The continuous layer includes a first portion in which an electronic component lies and a second portion where no electronic component lies. The first portion is at least 30 nm thick and includes a first guest material, and the second portion is no more than 40 nm thick.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.