Method and apparatus for high temperature operation of electronics
US7268019B2 · kind B2 · utility
14Cited by
22References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2004 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Mar 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of methods and apparatus for high temperature operation of electronics according to the invention are disclosed. One embodiment of the invention generally includes an integrated circuit package having a substrate. A plurality of integrated circuits are coupled to a surface of the substrate. A lid is positioned above the substrate facing the surface. One or more pieces of compliant and thermally conductive material are compressed between at least one of the integrated circuits and the lid. The lid defines in part an enclosed volume containing the compliant and thermally conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.