Heat dissipation device
US7269010B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 15, 2005 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Nov 4, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device for dissipating heat from an electronic package comprises a heat sink, a fan, a fan mounting structure, and fixing devices. The heat sink comprises a main body which comprises a cutout on each corner. The fan mounting structure mounts on two opposite sides of the heat sink and the fixing devices fix the fan on the fan mounting structure wherein the fixing devices extend through the mounting structure into the cutouts and do not damage the heat sink. The fan mounting structure has two lower plates fitted into two grooves in two opposite sides of the heat sink. Each lower plate extends along a whole length of each of the grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.