Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
US7269899B2 · kind B2 · utility
6Cited by
17References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2003 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Feb 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.