Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
US7270712B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2002 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | May 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09918
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller (22) includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head (50) and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.