Method of structuring of a substrate
US7270940B2 · kind B2 · utility
1Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2003 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Aug 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for selectively reducing a density of polymerization starters of the polymerization starter layer, applying monomers and then polymerizing of the monomers, the polymerization being initiated by the starters of the polymerization starter layer, and structuring the substrate using the polymerized monomers as a mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.