Forming a conductive pattern on a substrate
US7271099B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2005 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Aug 30, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a conductive pattern on a substrate. The method comprising providing a substrate carrying a conductive layer; forming a first portion of the conductive pattern by exposing the conductive layer to a laser and controlling the laser to remove conductive material around the edge(s) of desired conductive region(s) of the first portion; and laying down an etch resistant material on the conductive layer, the etch resistant material defining a second portion of the conductive pattern, removing conductive material from those areas of the second portion not covered by the etch resistant material, and then removing the etch resistant material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.