Via shielding for power/ground layers on printed circuit board
US7271349B2 · kind B2 · utility
4Cited by
15References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2004 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Jul 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09718
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the conductive layer and create a short circuit. In one embodiment, the protective coating is sufficiently hard to deflect a drill bit being used to drill the via hole, thus protecting against misregistered drilled holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.