Optoelectronic component

US7271425B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Karlheinz Arndt · Regensburg, DE
• Georg Bogner · Lappersdorf, DE
• Gunter Waitl · Regensburg, DE
• Matthias Winter · Regensburg, DE

Key dates

• Filing date: Nov 27, 2003
• Grant date: Sep 18, 2007
• Expiry date: Nov 27, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506

Abstract

The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.