Thermal stress relieved overmolded mounting base
US7271513B2 · kind B2 · utility
4Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2005 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Feb 15, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2705/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing and an overmolded mounting base. A plate is provided with mounting surfaces having a range of alignments including a nominal alignment. The plate is overmolded to form an overmolded plate. The overmolding changes the alignment of the mounting surfaces. The overmolded plate is maintained at a creep temperature for a time interval sufficient for creep to restore the alignment toward the nominal alignment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.