Method of automatically creating a semiconductor processing prober device file
US7271609B2 · kind B2 · utility
1Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2005 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Jul 29, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/318511
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described is a method for automatically generating a wafer prober file whereby testing parameters and die identities can be established for testing a complete semiconductor wafer and whereby acceptable or rejected dies can be identified and correlated later with where the good or bad dies are physically located on a wafer-under-test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.